LOCTITE® ABLESTIK ABL 2100A
功能與優點
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. It can withstand the high reflow temperatures necessary for Pb-free solders @ 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7 mm (0.5” x 0.5”), and has ultra-low moisture absorption.
瞭解更多
技術資訊
| 固化類型 | 熱固化 |
| 導熱性 | 1.2 W/mK |
| 應用 | 晶片焊接 |
| 熱膨脹係數 (CTE) | 65.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 200.0 ppm/°C |
| 玻璃化溫度(Tg) | 60.0 °C |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
| 觸變指數 | 5.3 |
LOCTITE® ABLESTIK ABL 2100A
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.