LOCTITE® ABLESTIK ABL 2100A
Caratteristiche e vantaggi
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. It can withstand the high reflow temperatures necessary for Pb-free solders @ 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7 mm (0.5” x 0.5”), and has ultra-low moisture absorption.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 65.0 ppm/°C |
| Coefficiente di espansione termica (CTE), Above Tg | 200.0 ppm/°C |
| Conducibilità termica | 1.2 W/mK |
| Indice tixotropico | 5.3 |
| Temperatura di transizione vetrosa (Tg) | 60.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABL 2100A
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.