LOCTITE® ABLESTIK ABL 2100A
Features and Benefits
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. It can withstand the high reflow temperatures necessary for Pb-free solders @ 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7 mm (0.5” x 0.5”), and has ultra-low moisture absorption.
- Ultra-low moisture absorption
- Pb-free applications
- High hot/wet adhesion
- Excellent dispensing characteristics
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 200.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 60.0 °C |
| Thermal conductivity | 1.2 W/mK |
| Thixotropic index | 5.3 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABL 2100A
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.