LOCTITE® ABLESTIK ABL 2100A
Características y Ventajas
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. It can withstand the high reflow temperatures necessary for Pb-free solders @ 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7 mm (0.5” x 0.5”), and has ultra-low moisture absorption.
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Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 65.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 200.0 ppm/°C |
| Conductividad térmica | 1.2 W/mK |
| Temperatura de transición vítrea (Tg) | 60.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
| Índice tixotrópico | 5.3 |
LOCTITE® ABLESTIK ABL 2100A
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.