LOCTITE® ABLESTIK ABP 8065T
특징 및 이점
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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기술 정보
| 경화 방식 | 열경화 |
| 열전도율 | 10.0 W/mK |
| 열팽창 계수(CTE) | 40.0 ppm/°C |
| 열팽창 계수(CTE), Above Tg | 146.0 ppm/°C |
| 요변성 지수 | 6.0 |
| 적용 분야 | 다이 접착 |
| 점도, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive