LOCTITE® ABLESTIK ABP 8065T
特長および利点
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
詳細はこちら
技術情報
| アプリケーション(用途) | ダイ接着剤 |
| チクソ性指数 | 6.0 |
| 熱伝導率 | 10.0 W/mK |
| 熱膨張率 | 40.0 ppm/°C |
| 熱膨張率, Above Tg | 146.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive