LOCTITE® ABLESTIK ABP 8065T
Elementi i pogodnosti
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Dokumenti i preuzimanja
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Tehnički podaci
| Koeficijent toplotnog širenja (CTE) | 40.0 ppm/°C |
| Koeficijent toplotnog širenja (CTE), Above Tg | 146.0 ppm/°C |
| Primene | Dodavanje boje |
| Tiksotropni indeks | 6.0 |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Toplotna provodljivost | 10.0 W/mK |
| Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8065T
LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive