LOCTITE® ABLESTIK ABP 8065T

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LOCTITE ABLESTIK ABP 8065T, BMI Acrylate, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8065T highly filled, conductive die-attach adhesive is designed for bonding mini dies in high reliability package applications. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Tehniline andmeleht
LOCTITE® ABLESTIK ABP 8065T
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Tehniline teave

Rakendused Stantskinnitus
Soojusjuhtivus 10.0 W/mK
Soojuspaisumise koefitsient (CTE) 40.0 ppm/°C
Soojuspaisumise koefitsient (CTE), Above Tg 146.0 ppm/°C
Tahkumistüüp Kuumkõvenemine
Tiksotroopne indeks 6.0
Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9000.0 mPa.s (cP)