LOCTITE® ABLESTIK ABP 2030SCR
Features and Benefits
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.
LOCTITE® ABLESTIK ABP 2030SCR is a 1-part, silver-filled, solvent-free die-attach adhesive designed for high-throughput, stress-sensitive semiconductor assembly. It supports efficient thermal management and is ideal for bonding die to dissimilar substrates, particularly in sensitive electronics environments. It is snap curable for rapid handling and cures when exposed to heat.
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Thermal conductivity | 2.0 W/mK |
| Thixotropic index | 5.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 15000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2030SCR
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.