LOCTITE® ABLESTIK ABP 2030SCR
Kenmerken en voordelen
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.
LOCTITE® ABLESTIK ABP 2030SCR is a 1-part, silver-filled, solvent-free die-attach adhesive designed for high-throughput, stress-sensitive semiconductor assembly. It supports efficient thermal management and is ideal for bonding die to dissimilar substrates, particularly in sensitive electronics environments. It is snap curable for rapid handling and cures when exposed to heat.
Meer info
Documenten en downloads
Op zoek naar een TDS of MSDS in een andere taal?
Technische informatie
| Thermische geleidbaarheid | 2.0 W/mK |
| Thixotrope index | 5.0 |
| Toepassingen | Matrijsmontage |
| Uithardingstype | Uitharding door warmte |
| Viscositeit, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 15000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2030SCR
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.