LOCTITE® ABLESTIK ABP 2030SCR
Caractéristiques et avantages
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.
LOCTITE® ABLESTIK ABP 2030SCR is a 1-part, silver-filled, solvent-free die-attach adhesive designed for high-throughput, stress-sensitive semiconductor assembly. It supports efficient thermal management and is ideal for bonding die to dissimilar substrates, particularly in sensitive electronics environments. It is snap curable for rapid handling and cures when exposed to heat.
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Informations techniques
| Applications | Soudage de puce |
| Conductivité thermique | 2.0 W/mK |
| Indice thixotropique | 5.0 |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 15000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2030SCR
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.