LOCTITE® ABLESTIK ABP 2030SCR
Vlastnosti a výhody
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.
LOCTITE® ABLESTIK ABP 2030SCR is a 1-part, silver-filled, solvent-free die-attach adhesive designed for high-throughput, stress-sensitive semiconductor assembly. It supports efficient thermal management and is ideal for bonding die to dissimilar substrates, particularly in sensitive electronics environments. It is snap curable for rapid handling and cures when exposed to heat.
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Technické informace
| Aplikace | Připevnění formy |
| Tepelná vodivost | 2.0 W/mK |
| Tixotropní index | 5.0 |
| Viskozita, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 15000.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK ABP 2030SCR
This 1-part, silver-filled, heat-curing die-attach adhesive is designed for high-throughput, stress-sensitive semiconductor assembly.