LOCTITE® ABLESTIK SSP 2020

被稱為 LOCTITE ABLESTIK SSP 2020 18G

功能與優點

LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach
LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.
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技術資訊

可萃取出的離子含量, 氯化物(CI-) 0.9 ppm
可萃取出的離子含量, 鈉(Na+) 0.9 ppm
可萃取出的離子含量, 鉀(K+) 0.9 ppm
固化類型 熱固化
應用 晶片焊接
拉伸模量, @ 250.0 °C 5615.0 N/mm² (800000.0 psi )