LOCTITE® ABLESTIK SSP 2020
被称为 LOCTITE ABLESTIK SSP 2020 18G
功能与优点
LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach
LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.
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技术信息
| 可萃取出的离子含量, 氯化物 (CI-) | 0.9 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 0.9 ppm |
| 可萃取出的离子含量, 钾 (K+) | 0.9 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 5615.0 N/mm² (800000.0 psi ) |
LOCTITE® ABLESTIK SSP 2020
LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach