LOCTITE® ABLESTIK 8200C
功能与优点
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
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技术信息
| RT 模剪切强度, 3 x 3 mm Si die on SPCLF | 19.1 kg-f |
| 体积电阻率 | 0.00017 Ohm cm |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 175.0 °C 30 min. ramp | 45.0 分钟 |
| 导热性 | 1.2 W/mK |
| 应用 | 芯片焊接 |
| 拉伸模量, DMTA @ 250.0 °C | 759.0 N/mm² (110000.0 psi ) |
| 热膨胀系数 (CTE) | 60.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 130.0 ppm/°C |
| 玻璃化温度 (Tg) | 190.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
| 触变指数 | 5.0 |
| 颜色 | 银 |
LOCTITE® ABLESTIK 8200C
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive