LOCTITE® ABLESTIK 8200C
功能與優點
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
瞭解更多
技術資訊
| RT 模剪切強度, 3 x 3 mm Si die on SPCLF | 19.1 kg-f |
| 可萃取出的離子含量, 氯化物(CI-) | 9.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 9.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 9.0 ppm |
| 固化類型 | 熱固化 |
| 導熱性 | 1.2 W/mK |
| 建議固化方式, @ 175.0 °C 30 min. ramp | 45.0 分 |
| 應用 | 晶片焊接 |
| 拉伸模量, DMTA @ 250.0 °C | 759.0 N/mm² (110000.0 psi ) |
| 熱膨脹係數 (CTE) | 60.0 ppm/°C |
| 熱膨脹係數 (CTE), Above Tg | 130.0 ppm/°C |
| 玻璃化溫度(Tg) | 190.0 °C |
| 粘度，Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
| 觸變指數 | 5.0 |
| 顏色 | 銀色 |
| 體積電阻率 | 0.00017 Ohm cm |
LOCTITE® ABLESTIK 8200C
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive