LOCTITE® ABLESTIK 8387B
Features and Benefits
A black non-conductive adhesive for optoelectronic devices in aerospace and defence devices.
LOCTITE® ABLESTIK 8387B is a black non-conductive epoxy adhesive for high-throughput die attach applications. It's particularly used for glass attachment to optical and 3D sensors in aerospace and defence applications. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC (212ºF). If cured properly, it should pass the NASA outgassing standards.
- Fast curing
- Good adhesion to glass
- Jettable
- Non-conductive
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 94.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 165.0 ppm/°C |
| Color | Black |
| Cure schedule, @ 150.0 °C | 2.0 min. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 299.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | 96.0 °C |
| Hot die shear strength, @ 250.0 °C 12.7 x 12.7 mm Si die on Cu LF | 270.0 kg-f |
| Key characteristics | Conductivity: electrically non-conductive, Cure speed: fast cure |
| Number of components | 1 part |
| Physical form | Paste |
| RT die shear strength, 3 x 3 mm Si die on Cu LF @ 25°C | 4400.0 psi |
| Recommended for use with | Laminate, LeadFrame: silver |
| Tensile modulus, DMTA @ 250.0 °C | 53.0 N/mm² (7700.0 psi ) |
| Thixotropic index | 4.5 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8387B
A black non-conductive adhesive for optoelectronic devices in aerospace and defence devices.