BERGQUIST® SIL PAD® TSP 1800
Conocido como Sil-Pad® 1200
Características y Ventajas
This thermally conductive, fiberglass-reinforced silicone insulator pad has exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD® TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient repositioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Información técnica
| Color | Negro |
| Conductividad térmica | 1.8 W/mK |
| Espesor | 0.229 - 0.406 mm |
| Resistencia a la flama | V-0 |
| Tipo de vehículo | Fibra de Vidrio |
Preguntas frecuentes
¿Cómo puedo saber cuál producto SIL PAD es el adecuado para mi aplicación específica?
¿Qué es IS09001:2008?
BERGQUIST® SIL PAD® TSP 1800
This thermally conductive, fiberglass-reinforced silicone insulator pad has exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.