BERGQUIST® SIL PAD® TSP 1800
Connu sous le nom de Sil-Pad® 1200
Caractéristiques et avantages
This thermally conductive, fiberglass-reinforced silicone insulator pad has exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.
BERGQUIST® SIL PAD® TSP 1800 is a silicone-based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient repositioning and ease of use, as well as an optional adhesive coating. It exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw- and clip-mounted applications.
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Informations techniques
| Conductivité thermique | 1.8 W/mK |
| Cote d'inflammabilité | V-0 |
| Couleur | Noir |
| Type porteur | Fibre de verre |
| Épaisseur standard | 0.229 - 0.406 mm |
BERGQUIST® SIL PAD® TSP 1800
This thermally conductive, fiberglass-reinforced silicone insulator pad has exceptional thermal performance at lower application pressures. Easy handling, superior voltage breakdown.