Electronics

Insulated Metal Substrate (IMS)
Minimizes thermal impedance and conducts heat more effectively for higher watt-density surface mount applications.

Surface Mount Adhesives
Ideal for high-speed assembly processes, low-temperature processing, screen printing deposition and automatic dispensing for high-throughput and maximum process flexibility.

Solder Materials
High reliability alloys with halogen-free, halide-free chemistries for water-wash and no-clean tin-lead and lead-free manufacturing processes.

Gasketing
Eliminates corrosion and provides an instant, low-pressure seal on an assembly after full cure; will not shrink, crack or relax, and resists displacement.

Gasket Sealants

Electrically Conductive Adhesives
Highly conductive sliver-filled ECAs used as a solder alternative, with low temperature curing for high temp environments where solder may not be suitable.

Conformal Coatings
Safeguards PCB with acrylic, Polyurethane, urethane or silicone conformal coatings against adverse environmental conditions.

Liquid Gap Filler
Offering excellent thermal and mechanical performance – as a replacement for grease, potting compounds, or pads – for intricate and multilevel surfaces.

EMI Shielding

Thermally Conductive Adhesives
Adhesives with thermal fillers like silver or aluminum oxide that offer superior heat dissipation for a wide range of electronic applications, available in silicone, epoxy and hybrid BMI chemistries, which are hydrophobic.

Non-Conductive Paste
Pre-applied semiconductor underfill, facilitating bump protection and interconnection in a single step. offering excellent bump reinforcement and safeguarding for fine pitch devices.

Potting Compound
A permanent protective solution providing reliable shielding and adhesion against environmental influences, improving mechanical strength and providing high electrical insulation for PCBs.

Sealants
Used to seal surfaces in order to prevent passage of liquids or gas.

Sealants

Low Pressure Molding
Providing electrical insulation and temperature, vibration and solvent resistance for modern PCB and circuitry protection against high humidity, long-term UV exposure and thermal cycling.

Thermally Conductive Film Adhesives
Customizable liquid, tapes, pads, or mix for the mechanical attachment of components to a heat sink with thermal transfer properties and without the need for additional fasteners.

Thermal Pads
Effective thermal interface between heat sinks and electronic devices with shock dampening qualities for conformability and higher thermal performance, also available silicone-free.

Electrically Insulating Film Adhesives
Dielectric films and tapes offer conformability, easy application, and reliable tack designed to perform at high temperatures and resist oxidation, solvents, and oils while maintaining physical and electrical integrity.

CSP Underfills (Cornerbond)
Offering reworkable and non-reworkable formulations that lower stress, improve reliability, offer room temperature flowability, and effectively fill bottom-side components spaces with low bump heights.

Inks for Printed Electronics
Offering specialized and cross-functional silver, carbon, dielectric, and clear conductive inks for fine-line printing and the miniaturized dimensions of modern-day electronics.

Medical

Phase Change (HI-FLOW) Materials and Greases
Offer outstanding thermal impedance between heat dissipating devices and their opposing assembly surfaces, available in printable, dispensable and film formats. performance.

Glob Top & Encapsulants
Superior protection for electronic components attached to circuit boards. Chip-on-board components are shielded from environmental stresses, contamination, and mechanical vibration. Available in silicones, epoxies and hybrid chemistries.

Electrically Conductive Film Adhesives
Available in sheets, and precut to specific shapes and sizes, offer great thermal and electrical properties for bonding circuit boards to metal frames and heat sinks.