LOCTITE® ABLESTIK ABP 2100AC
Known as ABP-2100AC (35g)
Features and Benefits
LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able towithstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
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Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Cure type | Heat cure |
LOCTITE® ABLESTIK ABP 2100AC
LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach