LOCTITE® ABLESTIK NCA 2380
功能与优点
This epoxy electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.
LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure.
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技术信息
| 储能模量 | 3.0 GPa |
| 固化方式 | 热+紫外线 |
| 热膨胀系数 (CTE) | 56.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 183.0 ppm/°C |
| 玻璃化温度 (Tg) | 95.0 °C |
| 粘度, Shear Rate 10 s⁻¹ | 35000.0 mPa.s (cP) |
| 触变指数 | 2.4 |
LOCTITE® ABLESTIK NCA 2380
This epoxy electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.