LOCTITE® ABLESTIK NCA 2380
Features and Benefits
This epoxy electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.
LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure.
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Technical Information
| Coefficient of thermal expansion (CTE) | 56.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 183.0 ppm/°C |
| Cure type | Heat + UV cure |
| Glass transition temperature (Tg) | 95.0 °C |
| Storage modulus | 3.0 GPa |
| Thixotropic index | 2.4 |
| Viscosity, Shear Rate 10 s⁻¹ | 35000.0 mPa·s (cP) |
LOCTITE® ABLESTIK NCA 2380
This epoxy electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.