BERGQUIST® HI FLOW THF 1600P
Features and Benefits
A high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement - designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.
BERGQUIST® HI FLOW THF 1600P is an electrically insulating, thermally-conductive 55°C (131°F) phase reinforced change material with high temperature reliability (150°C / 302°F). Its polymide film provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The easy-release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices that require electrical isolation to the heat sink.
- Thermal impedance: 0.13°C (32°F) in2/W @ 25 psi
- Outstanding thermal performance in an insulated pad
- Excellent cut-through resistance
- Excellent dielectric performance
- Phase change softening temp 55°C (131°F)
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Polyimide |
| Color | Green |
| Flame rating | V-0 |
| Operating temperature | 150.0 °C |
| Standard thickness | 0.102 - 0.127 mm |
| Thermal conductivity | 1.6 W/mK |
BERGQUIST® HI FLOW THF 1600P
A high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement - designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.