LOCTITE® ABLESTIK 84-3MV
Features and Benefits
LOCTITE ABLESTIK 84-3MV, Epoxy, Die Attach
LOCTITE® ABLESTIK 84-3MV adhesive is designed for medium die attach applications. This adhesive is ideal for application by stamping or dispensing. Please refer to the TDS for alternate cure schedules.
- Electrically Insulating
- Low viscosity
- Non-conductive
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 40.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 110.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 70.0 °C |
| Thermal conductivity | 0.5 W/mK |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 29000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 84-3MV
LOCTITE ABLESTIK 84-3MV, Epoxy, Die Attach