LOCTITE® ABLESTIK 2025D
被称为 ABLEBOND 2025D (14G)
功能与优点
A red non-conductive die-attach adhesive for PBGA, FlexBGA and Stacking BGA.
LOCTITE® ABLESTIK 2025D is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for array packaging. It exhibits minimal resin bleed-out (RBO) and is typically used in PBGA, FlexBGA, and Stacking BGA package applications. LOCTITE ABLESTIK 2025D cures when exposed to heat to form a strong material with excellent hot/wet die shear strength and good adhesion to many different substrates.
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技术信息
| RT 模剪切强度 | 20.0 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 导热性 | 0.4 W/mK |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 116.0 N/mm² (16800.0 psi ) |
| 热模剪切强度 | 3.5 kg-f |
| 热膨胀系数 (CTE) | 48.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 140.0 ppm/°C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa.s (cP) |
| 触变指数 | 4.4 |
LOCTITE® ABLESTIK 2025D
A red non-conductive die-attach adhesive for PBGA, FlexBGA and Stacking BGA.