BERGQUIST® LIQUI FORM TLF 6000
Features and Benefits
BERGQUIST LIQUI FORM TLF 6000, Thermally Conductive, One-Part, Liquid Formable Gel Material
BERGQUIST® LIQUI FORM TLF 6000 thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. BERGQUIST LIQUI FORM TLF 6000 is pre-cured, requiring no mixing or refrigeration.
- Thermal Conductivity: 6.0 W/m-K
- Excellent chemical stability and mechanical stability
- Stable viscosity in storage and in the application
- Dispensable pre-cured gel
Documents and Downloads
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Technical Information
| Color | Gray |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 6.0 W/mK |
BERGQUIST® LIQUI FORM TLF 6000
BERGQUIST LIQUI FORM TLF 6000, Thermally Conductive, One-Part, Liquid Formable Gel Material