Protecting Materials/Circuit Board Protection/Connection Materials
High-performance electronics require adequate protection from adverse environmental conditions and external interference. Henkel´s conformal coating solutions protect the PCB from moisture and chemical contaminants, while our package- and board-level EMI shielding materials offer vital radio-frequency interference resistance for today’s smart appliances that incorporate wireless technologies. Once populated with high-value, high-density components, these devices need to be safeguarded against vibration and shock.
Market-leading LOCTITE® underfill formulations deliver added solder joint reliability to defend against stress. To secure the entire electronic system, Henkel’s potting materials and TECHNOMELT® low pressure molding hot melts deliver robust defense against harsh environments, encapsulating the assembly for maximum protection. Moreover, Henkel functional inks and coatings are helping manufactures develop new types of printed circuit board designs.
Joining all of the components for collaborative operation and high reliability is the job of Henkel’s portfolio of advanced connecting materials. Electrical interconnection at the board level is facilitated by our wide portfolio of solder materials (lead-free alloys, high-reliability alloy, halogen-free solder formulations) and a broad range of electrically conductive adhesive. Our material scientists and engineering teams understand the application-specific requirements, process objectives, and manufacturing demands to advise on the best solutions for optimal results.