BERGQUIST® GAP FILLER TGF 2000
Conocido como Gap Filler 2000
Características y Ventajas
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
Leer más
Documentos y Descargas
¿Está buscando un TDS o SDS en otro idioma?
Documentos adicionales
Información técnica
| Capacidad calorífica, ASTM E1269 | 1.0 J/g-K |
| Conductividad térmica | 2.0 W/mK |
| Constante dieléctrica, @ 1kHz | 7.0 |
| Densidad | 2.9 g/cm³ |
| Dureza Shore, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
| Relación de mezcla, por peso | 1 : 1 |
| Relación de mezcla, por volumen | 1 : 1 |
| Resistencia a la flama | V-0 |
| Resistividad de volumen | 1×10 Ohm m |
| Temperatura de almacenaje | 25.0 °C |
| Vida útil de almacenamiento | 6.0 mes |
| Endurecedor | |
| Color, Endurecedor | Blanco |
| Resina | |
| Color, Resina | Rosa |
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.