BERGQUIST® GAP FILLER TGF 3500LVO
Features and Benefits
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). The ultra-conforming feature combined with its low volatility makes it the ideal solution for use in medical electronics and other fragile or low stress assemblies such as Optics and Automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components and will cure at room temperature or can be sped up with the addition of heat. This product is curable at room temperature however, the cure rate can also be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- Thermal conductivity: 3.5 W/m-K
- 100% solids with no additional cure by-products
- Low volatility for outgassing and silicone sensitive applications
- Ultra-conforming, with excellent wet-out for low stress interface applications
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 3.5 W/mK |
| Mixed | |
| Color, Mixed | Light blue |
| Resin | |
| Color, Resin | Blue |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 3500LVO
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.