LOCTITE® ECCOBOND BF 4
功能與優點
LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
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技術資訊
儲存溫度 | -40.0 °C |
剪切強度 | 24.0 kg-f |
建議固化方式, @ 100.0 °C | 30.0 分 |
應用 | 晶片焊接 |
玻璃化溫度(Tg) | 94.0 °C |
粘度,Brookfield CP51, @ 25.0 °C Speed 5 rpm | 23500.0 mPa.s (cP) |
零組件數 | 1 組分 |
顏色 | 黑色 |