LOCTITE® ECCOBOND BF 4

功能與優點

LOCTITE ECCOBOND BF 4 is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
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技術資訊

儲存溫度 -40.0 °C
剪切強度 24.0 kg-f
建議固化方式, @ 100.0 °C 30.0 分
應用 晶片焊接
玻璃化溫度(Tg) 94.0 °C
粘度,Brookfield CP51, @ 25.0 °C Speed 5 rpm 23500.0 mPa.s (cP)
零組件數 1 組分
顏色 黑色