LOCTITE® ABLESTIK 84-1LMI

被稱為 ABLEBOND 84-1LMI

功能與優點

Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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技術資訊

儲存溫度 -40.0 °C
剪切強度, 鋁 1500.0 psi
固化類型 熱固化
建議固化方式, @ 150.0 °C 1.0 小時
應用 晶片焊接
物理形態 黏貼
粘度,Brookfield CP51, @ 25.0 °C Speed 5 rpm 30000.0 mPa.s (cP)
觸變指數 4.0
零組件數 1 組分
體積電阻率 0.0005 Ohm cm