LOCTITE® ABLESTIK ABP 8060T
被稱為 ABP 8060T (18G)
功能與優點
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
瞭解更多
技術資訊
| 可萃取出的離子含量, 氯化物(CI-) | 9.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 9.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 9.0 ppm |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 熱膨脹係數 (CTE) | 55.0 ppm/°C |
LOCTITE® ABLESTIK ABP 8060T
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach