BERGQUIST® LIQUI FORM TLF 6000HG
功能与优点
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.
Award-winning BERGQUIST® LIQUI FORM TLF 6000HG is a thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0mm, delivering robust vertical gap stability.
- 可点胶预固导热凝胶
- 导热性能：6.0 W/m-K
- 在储存及使用中具有稳定粘度
- 优异的化学及机械稳定性
文件和下载
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技术信息
| 保质期, @ 25.0 | 365.0 天 |
| 导热性 | 6.0 W/mK |
| 操作温度 | -60.0 - 200.0 °C |
| 阻燃性 | V-0 |
BERGQUIST® LIQUI FORM TLF 6000HG
One-part, gray, silicone-based, fully cured thermal interface gel specially formulated to provide a balanced mix of superior thermal reliability, good dispensing efficiency, and high thermal conductivity.