LOCTITE® ABLESTIK NCA 2340
功能与优点
LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive
LOCTITE® ABLESTIK NCA 2340 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. This product is formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.
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技术信息
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 61.0 ppm/°C |
| 玻璃化温度 (Tg) | 83.0 °C |
| 粘度，博勒菲, Shear Rate 10 s⁻¹ | 35000.0 mPa.s (cP) |
| 触变指数 | 5.3 |
LOCTITE® ABLESTIK NCA 2340
LOCTITE ABLESTIK NCA 2340, Acrylated Epoxy, Assembly, Dual Cure Adhesive