LOCTITE® ABLESTIK 965-1L
功能与优点
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach
LOCTITE® ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
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技术信息
| RT 模剪切强度, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 10.0 kg-f |
| 体积电阻率 | ≤ 0.0005 Ohm cm |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 150.0 °C | 1.0 小时 |
| 导热性 | 3.0 W/mK |
| 应用 | 芯片焊接 |
| 热模剪切强度, 2 x 2 mm (80 x 80 mil) Si die on Ag/Cu LF | 0.6 kg-f |
| 热膨胀系数 (CTE) | 50.0 ppm/°C |
| 热膨胀系数 (CTE), Above Tg | 190.0 ppm/°C |
| 玻璃化温度 (Tg) | 72.0 °C |
| 粘度，博勒菲 CP51, @ 25.0 °C Speed 5 rpm | 12000.0 mPa.s (cP) |
| 触变指数 | 4.5 |
| 颜色 | 银 |
LOCTITE® ABLESTIK 965-1L
LOCTITE ABLESTIK 965-1L, Epoxy, Die attach