BERGQUIST® GAP PAD® TGP 3000
Poznano kot Gap Pad® 3000S30
Lastnosti in prednosti
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fibreglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited to high-performance, low-stress-sensitive applications.
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Tehnične informacije
| Barva | Svetlo modra |
| Delovna temperatura | -60.0 - 200.0 °C |
| Dielektrična konstanta, ASTM D150 @ 1kHz | 7.0 |
| Gostota | 3.2 g/cm³ |
| Napetost dielektrične razgradnje | 3000.0 Vac |
| Ocena plamena | V-0 |
| Prostorninska upornost | 1×10 Ohm m |
| Standardna debelina | 0.254 - 3.175 mm |
| Toplotna zmogljivost, ASTM E1269 | 1.0 J/g-K |
| Trdota po Shoru, Thirty second delay value, ASTM D2240 Razsuta guma Shore 00 | 30.0 |
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.