BERGQUIST® HI FLOW THF 1000U
Poznano kot Hi-Flow® 225U
Lastnosti in prednosti
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material
BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
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Tehnične informacije
| Barva | Črna |
| Delovna temperatura | 150.0 °C |
| Ocena plamena | V-0 |
| Standardna debelina | 0.036 mm |
| Toplotna prevodnost | 0.1 W/mK |
BERGQUIST® HI FLOW THF 1000U
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material