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Henkel continues to lead in Appliance & HVAC solutions, and today announced its latest innovations, UL 746C recognized silicones with 230C ratings which cure at room temperature and enable ultra-high temperature resistance and unmatched thermocycling performance. 

The new and innovative Henkel INKxperience Kit offers four different printed electronic technology sensors pre-configured with hardware and software for prototyping and engineering ideation. The kit is designed for professional engineers and developers to experiment with the technology of printed electronics for the development of IoT sensor solutions

Thinking Beyond: A Vision For Human Progress

In a rapidly changing world of endless technological possibilities and need for adaptation, people's desire for meaning and value is stronger than ever. At Henkel, we believe: Progress should not be limited to a privileged few but should be inclusive, making our lives better. For all of us. That’s why we think beyond existing boundaries and routines, beyond adhesives, and even beyond products to achieve sustainable and human-centred progress that is accessible to everyone.

Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its enabling impact on some of the most demanding package designs used in the automotive, industrial, and high-performance computing sectors.

“As the SEMICON Taiwan show organizers have emphasized,” comments Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur, “the semiconductor industry is central to nearly all technology development and to solving some of the world’s biggest challenges. Henkel is a key contributor to this progress, delivering cutting-edge semiconductor packaging materials for high reliability automotive packaging, AI and high-performance computing, and...