BERGQUIST® GAP PAD® TGP 3000
Poznat kao Gap Pad® 3000S30
Elementi i pogodnosti
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fibreglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited to high-performance, low-stress-sensitive applications.
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Tehnički podaci
| Boja | Svetlo plava |
| Dielektrična konstanta, ASTM D150 @ 1kHz | 7.0 |
| Dielektrični proboj napona | 3000.0 Vac |
| Gustina | 3.2 g/cm³ |
| Otpornost na plamen | V-0 |
| Radna temperatura | -60.0 - 200.0 °C |
| Standardna debljina | 0.254 - 3.175 mm |
| Toplotni kapacitet, ASTM E1269 | 1.0 J/g-K |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Guma u komadu Shore 00 | 30.0 |
| Zapreminska otpornost | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.