LOCTITE® ABLESTIK 8008HT
다른 명칭: ABLECOAT 8008HT
특징 및 이점
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high power devices in a high UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallization required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. Should be used with a pressure sensitive dicing tape. Not compatible with UV dicing tapes.
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문서 및 다운로드
다른 언어로 작성된 TDS 또는 SDS를 찾고 계신가요?
기술 정보
| RT 다이 전단 강도, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| 경화 방식 | 열경화 |
| 경화 시간, Snap Cure @ 170.0 °C | 20.0 초 |
| 색상 | 은색 |
| 열전도율 | 11.0 W/mK |
| 열팽창 계수(CTE) | 37.0 ppm/°C |
| 열팽창 계수(CTE), Above Tg | 62.0 ppm/°C |
| 요변성 지수 | 4.0 |
| 유리전이온도(Tg) | 264.0 °C |
| 인장 탄성률, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| 적용 분야 | 다이 접착 |
| 점도, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
| 체적 저항률 | 0.00005 Ohm cm |
| 추출 가능 이온 함량, 나트륨 이온(Na+) | 9.0 ppm |
| 추출 가능 이온 함량, 염소 이온(CI-) | 9.0 ppm |
| 추출 가능 이온 함량, 칼륨 이온(K+) | 9.0 ppm |
| 핫 다이 전단 강도, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
LOCTITE® ABLESTIK 8008HT
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.