미주
아시아 태평양
유럽
남아시아, 중동, 아프리카
헨켈은 최적화된 혁신적인 접착제로 복잡한 휴대 기기 적용 분야에 필요한 가공성을 제공합니다. 이 접착 재료들은 빠른 생산 사이클 시간에 적합하도록 저온에서 신속히 경화되고 안정성이 높아 저장, 스테이징 및 사용이 편리합니다. 헨켈은 휴대폰 및 기타 휴대 기기의 CSP, BGA, LGA, WLSP 부품의 기계적 강인성을 높이는 언더필과 플립칩 어셈블리의 열 사이클 신뢰도를 크게 향상하는 언더필을 포함해 다양한 언더필 제품을 제공합니다.
첨단 LOCTITE® 구조용 접착제는 휴대 기기의 인클로저, 하위 어셈블리, 외부 장식이 장기적으로 견고한 조립 상태를 유지하도록 합니다. 헨켈의 광범위한 화학 플랫폼 포트폴리오를 통해 제조사들은 적용 분야별 요건에 따라 제품을 자유롭게 선택할 수 있습니다. 또한 외부 오염원이나 물이 침투하지 않도록 제품을 보호하는 이점도 누릴 수 있습니다.
Fingerprint Button Bonding
Henkel delivers a full portfolio of material solutions from conductive and non-conductive adhesives, die attach materials to encapsulants for robust sensor development and production
Camera Module Bonding
A range of materials that includes die attach and bonding adhesives allows reliable, streamlined assembly of fixed-focus and auto-focus lenses to ensures proper lens alignment for reliable performance and cures quickly for better processing.
EMI Shielding
Package-level compartment and conformal coating EMI solutions facilitate smaller and thinner system-in-package designs. The materials enable high automation and provide excellent shielding performance.
MEMS Applications
Henkel’s comprehensive portfolio of off-the-shelf die attach, underfill, encapsulant and adhesive materials allows MEMS manufacturers to meet challenging performance requirements and time-to-market timelines.
Interconnecting
Solder pastes, electrically conductive materials offer fast, low temperature processing to accommodate delicate MEMS circuitry and balance cost/performance ratios with a options for miniaturized devices.
Solder Materials, ECA, Inks & Coatings
Interconnecting
Solder pastes, electrically conductive materials offer fast, low temperature processing to accommodate delicate MEMS circuitry and balance cost/performance ratios with a options for miniaturized devices.
Solder Materials, ECA, Inks & Coatings
Interconnecting
Solder pastes, electrically conductive materials offer fast, low temperature processing to accommodate delicate MEMS circuitry and balance cost/performance ratios with a options for miniaturized devices.
Solder Materials, ECA, Inks & Coatings
Wireless Charger Element Bonding
Henkel structural adhesives deliver high bond strength on various substrates with extremely fast fixturing for high volume production.
Structure & Bonding
Back Cover Bonding
Advanced structural adhesives provide strong adhesion on plastic,metal and glass substrates with fast fixturing for high UPH.
Structure & Bonding
Flexible Printed Circuit (FPC) Bonding
Loctite reinforcement materials provide added protection for flex circuitry used in smartphone applications. Good adhesion,high flexibility and crack resistance properties safeguard FPCs against damage.
Structure & Bonding
Cover Glass Bonding
Structural adhesives for smartphone cover glass bonding combine high adhesion strength and impact resistance. The ability to rework these materials allows customers to reduce costs and maximize resources.
Structure & Bonding
Speaker Mesh Bonding
PUR hotmelt, MS, UV and 2-Part polyurethane solutions for speaker mesh bonding deliver excellent bond strength and thin bondlines for minimized footprints.
Structure & Bonding
Side Key Button Bonding
Henkel structural adhesives are designed for low surface energy substrate bonding which is critical to side key's responsiveness. Our materials also can be fast cured for efficient production.
Structure & Bonding
Thermal Interface Materials
Liquid and soft, compliant pad TIMs provide critical thermal management for smaller, higher-functioning smartphones. Heat is transferred away from the components to prevent overheating and preserve performance.
Thermal Interface Materials
Coatings & Encapsulation
Henkel encapsulation and conformal coating materials protect PCBs and components against shock, drop, vibration, moisture and water ingress – making wearable devices more durable and reliable.
Glob Top & Encapsulants
Loctite encapsulants protect PCBs and components from shock, drop and vibration with strong adhesion, moisture resistance and IPX7 waterproofing without impacting signal strength, antenna capability or acoustic performance.
Underfill
Loctite brand underfills streamline processing with fast flow and quick curing. They surround delicate array device interconnects for strong, long-lasting protection to enhance reliability.
Underfill
Thermal Gel
Henkel's thermal gel materials offer ultra low modulus, excellent conformability to intricate geometries, efficient and simplified material usage and customizable flow characteristics.
Gap Filler
USB Connector Sealing
Advanced encapsulant and sealant technologies cover and protect USB connection ports, allowing device function while providing a barrier to prevent water’s penetration.
Device Protection
Frame Bonding & Sealants
Henkel structural adhesives combine high bond strength with the water-blocking qualities of low shrinkage, dense cross-linking and pressure resistance in easy-to-process formulations.
Structure & Bonding
Component Gasketing
To allow more production flexibility and reworkability, Henkel offers materials that enable sealant curing prior to assembly. With precise viscosity, an optimized durometer and a low compression set, Henkel cured-in-place gasketing (CIPG) materials deliver robust water protection.
Gasket Sealants
Cavity Gasketing
Henkel's liquid gasketing materials can be dispensed onto areas between rigid surfaces upon curing, provides well protection against moisture, corrosion, shock, drop and vibration.
Gasket Sealants
Enclosure Impregnation
Henkel’s wide range of chemistry platforms – from PUR hotmelts to MMAs, polyurethanes, cyanoacrylates, epoxies and silicones – can be impregnate into enclosures and help prevent penetration of external contaminants like dust and water.
Structure & Bonding, HOTMELT
Earphone Sealants
Around vulnerable entry points, such as the earphone socket, high performance sealants and encapsulants safeguard against water entry – helping to preserve electronic integrity should water immersion or exposure occur.
Through close customer partnership, industry know-how and engineering support, Henkel enables innovative design for smartphones and tablets.
Henkel’s leadership in the tablet and handheld sector is unmatched. In addition to the most comprehensive range of enabling materials that span the package-level to the board level to the external structure, our team provides the experience, engineering knowledge and documented design and application know-how for fast time-to-market and dependable device performance.
Henkel offers equipment designed specifically for material applications, providing a comprehensive solution for performance success. From simple handheld devices to fully automated systems, Henkel offers a complete line of standard off-the-shelf LOCTITE brand dispensing and light curing equipment, which can be integrated easily into your manufacturing process.
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