LOCTITE® ABLESTIK FS 849-TI
Known as ABLEBOND FS849-TI (22G)
Features and Benefits
LOCTITE ABLESTIK FS 849-TI, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus
LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a wide variety of die sizes where thermal and electrical conductivity are needed in a high reliability package.
- High thermal conductivity
- Medium modulus
- Low electrical resistance
- Low outgassing
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 44.0 ppm/°C |
| Cure type | Heat cure |
| Hot die shear strength | 4.1 kg-f |
| Tensile modulus, @ 250.0 °C | 1070.0 N/mm² (155190.0 psi ) |
LOCTITE® ABLESTIK FS 849-TI
LOCTITE ABLESTIK FS 849-TI, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus