LOCTITE® ABLESTIK 2100A
Known as ABLEBOND 2100A (34G)
Features and Benefits
This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in).
LOCTITE® ABLESTIK 2100A die attach adhesive is specifically designed for Pb-free array packaging. It is able to withstand the high reflow temperatures necessary for Pb-free solders at 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7mm (0.5in x 0.5in), has high hot/wet adhesion, ultra-low moisture absorption, and excellent dispensing characteristics.
- High hot/wet adhesion
- Ultra-low moisture absorption
- Low bleed and low stress
- Fast cure capability
- Pb-free applications
Documents and Downloads
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Additional Documents
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 5.0 kg-f |
| RT die shear strength | 16.0 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| Tensile modulus, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
LOCTITE® ABLESTIK 2100A
This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in).