LOCTITE® ABLESTIK ABP 8062T
旧名称 ABP-8062T (17.5g)
特長および利点
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
詳細はこちら
技術情報
| アプリケーション(用途) | ダイ接着剤 |
| 熱膨張率 | 100.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK ABP 8062T
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure