LOCTITE® ABLESTIK QMI538NB

Features and Benefits

LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.
  • Non-conductive
  • Low viscosity
  • Reduced resin bleed
  • Hydrophobic
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 59.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 130.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 19.0 ppm
Extractable ionic content, Fluoride (F-) 19.0 ppm
Extractable ionic content, Potassium (K+) 19.0 ppm
Extractable ionic content, Sodium (Na+) 19.0 ppm
Glass transition temperature (Tg) -70.0 °C
Hot die shear strength 15.0 kg-f
Storage temperature -40.0 °C
Tensile modulus, @ 25.0 °C 100.0 N/mm² (14500.0 psi )
Thixotropic index 5.0
Viscosity, @ 25.0 °C 8200.0 mPa·s (cP)