BERGQUIST® SIL PAD® TSP Q2000
Features and Benefits
This thermally conductive, fibreglass-reinforced silicone insulator pad is suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.
BERGQUIST® SIL PAD® TSP Q2000 eliminates problems associated with thermal grease, such as contamination of electronic assemblies and reflow solder baths. It can be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fibreglass reinforcement enables it to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.
- Thermal impedance: 0.35°C-in2/W (@50 psi)
- Eliminates processing constraints typically associated with grease
- Easy handling
- Conforms to surface textures
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Glass Fibre |
| Colour | Black |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 180.0 °C |
| Thermal conductivity | 0.2 W/mK |
BERGQUIST® SIL PAD® TSP Q2000
This thermally conductive, fibreglass-reinforced silicone insulator pad is suitable for applications prior to soldering and cleaning. Easy handling, low thermal impedance.