BERGQUIST® HI FLOW THF 1000U
Known as Hi-Flow® 225U
Features and Benefits
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material
BERGQUIST® HI FLOW THF 1000U is designed for use as a thermal interface material between a computer processor and a heat sink. The product consists of a thermally conductive 55°C phase change compound coated on a release liner and supplied on a carrier. Above its phase change temperature, BERGQUIST HI FLOW THF 1000U wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The material requires pressure of the assembly to cause flow
- Available in roll form with kiss-cut parts
- Thermally conductive 55°C phase change compound
- Hi-Flow® coating will resist dripping
- Thermal impedance: 0.07ºC-in2 /W @ 25 psi
Documents and Downloads
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Technical Information
| Color | Black |
| Flame rating | V-0 |
| Operating temperature | 150.0 °C |
| Standard thickness | 0.036 mm |
| Thermal conductivity | 0.1 W/mK |
BERGQUIST® HI FLOW THF 1000U
BERGQUIST HI FLOW THF 1000U, Non-Reinforced Phase Change Thermal Interface Material