BERGQUIST® GAP PAD® TGP 3000
Tuntud kui Gap Pad® 3000S30
Omadused ja eelised
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fibreglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited to high-performance, low-stress-sensitive applications.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, ASTM D150 @ 1kHz | 7.0 |
| Dielektriline läbilöögipinge | 3000.0 Vac |
| Mahu resistiivsus | 1×10 Ohm m |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm Shore 00 | 30.0 |
| Soojusmahtuvus, ASTM E1269 | 1.0 J/g-K |
| Standardpaksus | 0.254 - 3.175 mm |
| Tihedus | 3.2 g/cm³ |
| Töötemperatuur | -60.0 - 200.0 °C |
| Värvus | Helesinine |
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.