LOCTITE® ECCOBOND DS 3318BLX
Omadused ja eelised
LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation
LOCTITE® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key characteristic of this material, enabling stress absorption and providing extra protection from cracking in functional testing.
Lugege rohkem
Dokumendid ja allalaadimised
Teie asukoha ja keele kohta puuduvad dokumendid ning allalaadimised. Võite proovida otsida dokumenti teises keeles
Tehniline teave
| Klaasistumistemperatuur (Tg) | 68.0 °C |
| Rakendused | Kapseldamine |
| Sutheline pikenemine | 250.0 % |
| Säilitusmoodul, @ 25.0 °C | 510.0 MPa |
| Säilitustemperatuur | 25.0 °C |
| Tahkumistüüp | UV-kõvenemine |
| Viskoossus, Cone 20 mm, Angle 2° @ 25.0 °C Spindle TA, Shear Rate 15 s⁻¹ | 2050.0 mPa.s (cP) |
| Värvus | Sinine |
LOCTITE® ECCOBOND DS 3318BLX
LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation